According to SK Hynix, GDDR7 modules will go into mass manufacturing in the third quarter of this year, which runs from July to September. Faster bandwidth and increased power efficiency are features of the new modules.

According to SK Hynix, GDDR7 can produce up to 32 GB per pin, with a potential of 40 GB per pin "depending on the circumstances." The new memory modules can transmit 1.5TB per second when utilized on high-end GPUs with 384-bit memory buses (compared to 1.1TB per second for the previous version).



Furthermore, because of better packaging technology, SK Hynix was able to increase the power efficiency by "more than 50%" over the previous generation. It reduced thermal resistance by 74% by increasing the number of heat-dissipating layers from four to six (all while retaining the same physical dimensions).

Although "Graphics" is what the "G" in "GDDR" stands for, the business anticipates that other sectors will also employ its modules. "GDDR7 is expected to be adopted by a wider range of applications such as high-specification 3D graphics, AI, high-performance computing, and autonomous driving," stated Sangkwon Lee, Head of DRAM Product Planning & Enablement at SK Hynix.